In practice, it will be found that the copper in the copper roller plating solution is a kind of impurity that is easy to increase. It is consistent with metal impurities such as iron, which will reduce the conductivity of the solution, narrow the bright chromium layer area, and inevitably reduce the covering capacity. Because the copper roller belongs to the inner hole part, the corrosion and oxidation of chromic acid solution stained the plating solution.

When the mass concentration of copper impurities is relatively high, the bath temperature itself will remain the same. In general, the current density will be directly adjusted to 18A/dm2 or 20A/dm2. In this way, the coating will not have a significant impact. At the same time, the mass concentration of chromium anhydride can also be adjusted to the upper limit of the process (250g/L), relatively speaking, it is bound to reduce the mass concentration of impurities to a large extent, in order to improve the coating quality.

However, the mass concentration of copper impurities must be controlled under 6g/L, which is an important factor in copper roller chromium plating. At this time, we will take a series of methods to control, which is expected to slow down the accumulation of copper impurities, but also can extend the service life of the bath itself.

First of all, we are to pay attention to the inner wall of the roller can be coated with a layer of insulation film, after 24 hours of drying after electroplating. This film can also inhibit the corrosion and oxidation of chromic acid on the inner wall of copper; About its fixture should also pay attention to the use of iron materials for production, such as the end of the splint and the center fixed screw, that is, do not use copper (except hook).

In case of power failure, the plating parts should be taken out immediately to prevent the copper matrix from oxidation. Later, on the copper roller chromium plating, must pay attention to live under the groove, and in the process of filling the plating, it is strictly prohibited to carry out anodic treatment, at this time must be a small current density cathode activation, and then will inevitably rise to the normal current density after the plating.